|
If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
Datasheet File OCR Text: |
this is information on a product in full production. july 2014 docid025028 rev 3 1/13 STL4P2UH7 p-channel 20 v, 0.087 typ., 4 a stripfet? vii deepgate? power mosfet in a powerflat? 2x2 package datasheet - production data figure 1. internal schematic diagram features ? ultra logic level ? extremely low on-resistance r ds(on) ? high avalanche ruggedness ? low gate drive power losses applications ? switching applications description this device exhibits low on-state resistance and capacitance for improved conduction and switching performance. note: for the p-channel power mosfet the actual polarity of the voltages and the current must be reversed. 1(d) 2(d) 3(g) 6(d) 5(d) 4(s) d s am11269v1 powerflat? 2x2 1 2 3 6 5 4 1 2 3 order code v ds r ds(on) max i d STL4P2UH7 20 v 0.1 @ 4.5 v 4 a table 1. device summary order code marking package packaging STL4P2UH7 4l2u powerflat? 2x2 tape and reel www.st.com
contents STL4P2UH7 2/13 docid025028 rev 3 contents 1 electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 4 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 docid025028 rev 3 3/13 STL4P2UH7 electrical ratings 13 1 electrical ratings note: for the p-channel power mosfet the actual polarity of the voltages and the current must be reversed. table 2. absolute maximum ratings symbol parameter value unit v ds drain-source voltage 20 v v gs gate-source voltage 8 v i d (1) 1. the value is rated according to r thj-pcb drain current (continuous) at t pcb = 25 c 4 a i d (1) drain current (continuous) at t pcb = 100 c 2.5 a i dm (1)(2) 2. pulse width limited by safe operating area drain current (pulsed) 16 a p tot (1) total dissipation at t pcb = 25 c 2.4 w t stg storage temperature - 55 to 150 c t j max. operating junction temperature 150 c table 3. thermal data symbol parameter value unit r thj-pcb (1) 1. when mounted on 1inch 2 fr-4 board, 2 oz cu. thermal resistance junction-pcb max, single operation 52 c/w electrical characteristics STL4P2UH7 4/13 docid025028 rev 3 2 electrical characteristics (t c = 25 c unless otherwise specified) note: for the p-channel power mosfet the actual polarity of the voltages and the current must be reversed. table 4. on /off states symbol parameter test conditions min. typ. max. unit v (br)dss drain-source breakdown voltage v gs = 0, i d = 250 a 20 v i dss zero gate voltage drain current v gs = 0, v ds = 20 v 1 a i gss gate-body leakage current v ds = 0, v gs = 8 v 10 na v gs(th) gate threshold voltage v ds = v gs , i d = 250 a 0.4 1 v r ds(on) static drain-source on- resistance v gs = 4.5 v, i d = 2 a 0.087 0.1 ? v gs = 2.5 v, i d = 2 a 0.11 0.13 ? v gs = 1.8 v, i d = 2 a 0.145 0.18 ? table 5. dynamic symbol parameter test conditions min. typ. max. unit c iss input capacitance v gs = 0, v ds = 10 v, f = 1 mhz - 510 - pf c oss output capacitance - 66 - pf c rss reverse transfer capacitance -44-pf q g total gate charge v dd = 10 v, i d = 3 a, v gs = 4.5 v (see figure 14 ) -4.8-nc q gs gate-source charge - 0.7 - nc q gd gate-drain charge - 0.8 - nc table 6. switching times symbol parameter test conditions min. typ. max unit t d(on) turn-on delay time v dd = 10 v, i d = 1.5 a, r g = 4.7 ? , v gs = 4.5 v (see figure 15 ) -9-ns t r rise time - 21 - ns t d(off) turn-off delay time - 40 - ns t f fall time - 19 - ns docid025028 rev 3 5/13 STL4P2UH7 electrical characteristics 13 for the p-channel power mosfet the actual polarity of the voltages and the current must be reversed. table 7. source drain diode symbol parameter test conditions min. typ. max. unit i sd source-drain current - 4 a i sdm (1) 1. pulse width limited by safe operating area. source-drain current (pulsed) - 16 a v sd (2) 2. pulsed: pulse duration = 300 s, duty cycle 1.5% forward on voltage i sd = 1 a, v gs = 0 - 1 v t rr reverse recovery time v dd = 16 v di/dt = 100 a/s, i sd = 1 a t j =150 c (see figure 15 ) -12.8 ns q rr reverse recovery charge - 5 nc i rrm reverse recovery current - 0.8 a electrical characteristics STL4P2UH7 6/13 docid025028 rev 3 2.1 electrical characteristics (curves) figure 2. safe operating area figure 3. thermal impedance figure 4. output characteristics figure 5. transfer characteristics figure 6. gate charge vs gate-source voltage figure 7. static drain-source on-resistance , ' 9 ' 6 9 $ 2 s h u d w l r q l q w k l v d u h d l v / l p l w h g e \ p d [ 5 ' 6 r q p v p v ? v 7 m ? & 7 s f e ? & 6 l q j o h s x o v h * , 3 * 6 $ 6 l q j o h s x o v h g . w s v q d c * , 3 * 6 $ , ' 9 ' 6 9 $ 9 * 6 9 9 9 9 9 * , 3 * 6 $ , ' 9 * 6 9 $ 9 ' 6 9 * , 3 * 6 $ 9 * 6 4 j q & |